Three-dimensional integrated circuit

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Tan An-Nan	en_US
dc.contributor.author	Chen Hung-Ming	en_US
dc.date.accessioned	2014-12-16T06:13:47Z	-
dc.date.available	2014-12-16T06:13:47Z	-
dc.date.issued	2014-11-18	en_US
dc.identifier.govdoc	H01L023/36	zh_TW
dc.identifier.govdoc	H01L023/367	zh_TW
dc.identifier.govdoc	H01L023/48	zh_TW
dc.identifier.govdoc	H01L025/065	zh_TW
dc.identifier.govdoc	H01L023/42	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/104328	-
dc.description.abstract	A three-dimensional integrated circuit, including a first adhesive bonding layer, a first chip, a second chip, and an inter-stratum thermal pad, is provided. The first adhesive bonding layer has a first surface and a second surface opposite to each other. The first chip is disposed on the first surface of the first adhesive bonding layer. The first chip includes a hot zone. The second chip is disposed on the second surface of the first adhesive bonding layer. The inter-stratum thermal pad is embedded in the first adhesive bonding layer and faces to the hot zone.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Three-dimensional integrated circuit	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	08890303	zh_TW
顯示於類別：	專利資料

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