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dc.contributor.authorYi Chang Edwarden_US
dc.contributor.authorTang Shih-Hsuanen_US
dc.contributor.authorLin Yueh-Chinen_US
dc.date.accessioned2014-12-16T06:13:49Z-
dc.date.available2014-12-16T06:13:49Z-
dc.date.issued2014-08-05en_US
dc.identifier.govdocH01L021/20zh_TW
dc.identifier.govdocH01L021/36zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104357-
dc.description.abstractA structure of high electron mobility transistor growth on Si substrate and the method thereof, in particular used for the semiconductor device manufacturing in the semiconductor industry. The UHVCVD system was used in the related invention to grow a Ge film on Si substrate then grow the high electron mobility transistor on the Ge film for the reduction of buffer layer thickness and cost. The function of the Ge film is preventing the formation of silicon oxide when growing III-V MHEMT structure in MOCVD system on Si substrate. The reason of using MHEMT in the invention is that the metamorphic buffer layer in MHEMT structure could block the penetration of dislocation which is formed because of the very large lattice mismatch (4.2%) between Ge and Si substrate.zh_TW
dc.language.isozh_TWen_US
dc.titleStructure of high electron mobility transistor growth on Si substrate and the method thereofzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08796117zh_TW
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