完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chen Kuan-Neng | en_US |
dc.contributor.author | Hsu Sheng-Yao | en_US |
dc.date.accessioned | 2014-12-16T06:13:59Z | - |
dc.date.available | 2014-12-16T06:13:59Z | - |
dc.date.issued | 2013-08-13 | en_US |
dc.identifier.govdoc | H01L023/34 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/104452 | - |
dc.description.abstract | The present invention discloses a bonding method for a three-dimensional integrated circuit and the three-dimensional integrated circuit thereof. The bonding method comprises the steps of: providing a substrate; depositing a film layer on the substrate; providing a light source to light onto the film layer to form a graphic structure; forming a metal co-deposition layer by a first metal and a second metal that are co-deposited on the film layer; providing a first integrated circuit having the substrate, the film layer and the metal co-deposition layer sequentially; providing a second integrated circuit that having the metal co-deposition layer, the film layer and the substrate sequentially; and the first integrated circuit is bonded with the second integrated circuit at a predetermined temperature to form a three-dimensional integrated circuit. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 08508041 | zh_TW |
顯示於類別: | 專利資料 |