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dc.contributor.authorChiu Yien_US
dc.contributor.authorShih Hsi-Fuen_US
dc.contributor.authorLin Chen-Anen_US
dc.date.accessioned2014-12-16T06:14:00Z-
dc.date.available2014-12-16T06:14:00Z-
dc.date.issued2013-07-02en_US
dc.identifier.govdocG11B007/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104467-
dc.description.abstractAn optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.zh_TW
dc.language.isozh_TWen_US
dc.titleOptical pickup headzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08477573zh_TW
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