标题: | Vertical transmission line structure that includes bump elements for flip-chip mounting |
作者: | Chang Edward Yi Wu Wei-Cheng Hwang Ruey-Bing Hsu Li-Han |
公开日期: | 1-五月-2012 |
摘要: | A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. |
官方说明文件#: | H01L023/58 H01L023/34 H01P001/00 H01P005/00 H03H007/38 |
URI: | http://hdl.handle.net/11536/104585 |
专利国: | USA |
专利号码: | 08169276 |
显示于类别: | Patents |
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