Title: | Vertical transmission line structure that includes bump elements for flip-chip mounting |
Authors: | Chang Edward Yi Wu Wei-Cheng Hwang Ruey-Bing Hsu Li-Han |
Issue Date: | 1-May-2012 |
Abstract: | A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. |
Gov't Doc #: | H01L023/58 H01L023/34 H01P001/00 H01P005/00 H03H007/38 |
URI: | http://hdl.handle.net/11536/104585 |
Patent Country: | USA |
Patent Number: | 08169276 |
Appears in Collections: | Patents |
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