Title: Vertical transmission line structure that includes bump elements for flip-chip mounting
Authors: Chang Edward Yi
Wu Wei-Cheng
Hwang Ruey-Bing
Hsu Li-Han
Issue Date: 1-May-2012
Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
Gov't Doc #: H01L023/58
H01L023/34
H01P001/00
H01P005/00
H03H007/38
URI: http://hdl.handle.net/11536/104585
Patent Country: USA
Patent Number: 08169276
Appears in Collections:Patents


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