Vertical transmission line structure that includes bump elements for flip-chip mounting

標題:	Vertical transmission line structure that includes bump elements for flip-chip mounting
作者:	Chang Edward Yi Wu Wei-Cheng Hwang Ruey-Bing Hsu Li-Han
公開日期:	10-五月-2011
摘要:	A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
官方說明文件#:	H01L023/58 H01L023/34 H01P001/00 H01P005/00 H03H007/38
URI:	http://hdl.handle.net/11536/104669
專利國:	USA
專利號碼:	07940143
顯示於類別：	專利資料

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