标题: | Method for fabricating microneedle array and method for fabricating embossing mold of microneedle array |
作者: | Chiou Jin-Chern Hung Chen-Chun Chang Chih-Wei |
公开日期: | 30-九月-2008 |
摘要: | The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated. |
官方说明文件#: | B44C001/22 C25F003/00 |
URI: | http://hdl.handle.net/11536/104762 |
专利国: | USA |
专利号码: | 07429333 |
显示于类别: | Patents |
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