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dc.contributor.authorChenen_US
dc.contributor.authorWei-Kuoen_US
dc.contributor.authorLeeen_US
dc.contributor.authorMing-Chihen_US
dc.contributor.authorChouen_US
dc.contributor.authorWu-Chingen_US
dc.contributor.authorChenen_US
dc.contributor.authorWen-Hsiungen_US
dc.contributor.authorKeen_US
dc.contributor.authorWen-Chengen_US
dc.date.accessioned2014-12-16T06:14:30Z-
dc.date.available2014-12-16T06:14:30Z-
dc.date.issued2007-11-13en_US
dc.identifier.govdocC30B028/14zh_TW
dc.identifier.govdocC30B023/00zh_TW
dc.identifier.govdocC30B025/00zh_TW
dc.identifier.govdocC30B028/12zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104778-
dc.description.abstractProcess for fabricating self-assembled nanoparticles on buffer layers without mask making and allowing for any degree of lattice mismatch; that is, binary, ternary or quaternary nanoparticles comprising Groups III-V, II-VI or IV-VI. The process includes a first step of applying a buffer layer, a second step of turning on the purge gas to modulate the first reactant to the lower first flow rate, then the second reactant is supplied to the buffer layer to form a metal-rich island on the buffer layer, and a third step of turning on purge gas again to modulate the first reactant to the higher second flow rate onto the buffer layer. On the metal-rich island is formed the nanoparticles of the binary, ternary or quaternary III-V, II-VI and IV-IV semiconductor material. This is then recrystallized under the first reactant flow at high temperature forming high quality nanoparticles.zh_TW
dc.language.isozh_TWen_US
dc.titleProcess for manufacturing self-assembled nanoparticleszh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber07294202zh_TW
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