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dc.contributor.authorLIU Po-Tsunen_US
dc.contributor.authorTENG Li-Fengen_US
dc.contributor.authorLO Yuan-Jouen_US
dc.contributor.authorLEE Yao-Jenen_US
dc.date.accessioned2014-12-16T06:14:44Z-
dc.date.available2014-12-16T06:14:44Z-
dc.date.issued2014-09-25en_US
dc.identifier.govdocH01L021/477zh_TW
dc.identifier.govdocH01L029/66zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104867-
dc.description.abstractA method for fabricating a semiconductor device is disclosed in the present invention. The abovementioned method comprises the following steps. Firstly, a gate is formed on a substrate. A gate insulating layer is then formed on the gate, and further an active layer is disposed on the gate insulating layer, wherein the active layer is composed of a microwave absorbing material. Source/drain is defined on the active layer to form the semiconductor device, and a microwave annealing process is finally performed thereon.zh_TW
dc.language.isozh_TWen_US
dc.titleMETHOD FOR FABRICATING SEMICONDUCTOR DEVICEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20140287561zh_TW
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