Title: | METHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURES |
Authors: | CHEN Yu-Liang CHIEN Nai-Ying CHIU Hsin-Tien LEE Chi-Young |
Issue Date: | 20-Feb-2014 |
Abstract: | A method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive substrate in an electrolytic solution, and undertaking electrochemical deposition to form one-dimensional metallic nanostructures corresponding to the conductive film on the conductive substrate. The method fabricates high-surface-area one-dimensional metallic nanostructures on a flexible substrate, exempted from the high price of the photolithographic method, the complicated process of the hard template method, the varied characteristic and non-uniform coating of the seed-mediated growth method. |
Gov't Doc #: | C23C028/02 C25D007/12 C25D005/56 C25D005/54 B82Y099/00 B82Y040/00 |
URI: | http://hdl.handle.net/11536/104955 |
Patent Country: | USA |
Patent Number: | 20140048420 |
Appears in Collections: | Patents |
Files in This Item:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.