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dc.contributor.authorChin Alberten_US
dc.contributor.authorTsai Chun-Yangen_US
dc.date.accessioned2014-12-16T06:14:59Z-
dc.date.available2014-12-16T06:14:59Z-
dc.date.issued2013-06-06en_US
dc.identifier.govdocH01L029/792zh_TW
dc.identifier.govdocH01L021/336zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105040-
dc.description.abstractA MONOS Charge-Trapping flash (CTF), with record thinnest 3.6 nm ENT trapping layer, has a large 3.1V 10-year extrapolated retention window at 125° C. and excellent 106 endurance at a fast 100 is and ±16 V program/erase. This is achieved using As+-implanted higher κ trapping layer with deep 5.1 eV work-function of As. In contrast, the un-implanted device only has a small 10-year retention window of 1.9 V at 125° C. A MoN—[SiO2—LaAlO3]—[Ge—HfON]—[LaAlO3—SiO2]—Si CTF device is also provided with record-thinnest 2.5-nm Equivalent-Si3N4-Thickness (ENT) trapping layer, large 4.4 V initial memory window, 3.2 V 10-year extrapolated retention window at 125° C., and 3.6 V endurance window at 106 cycles, under very fast 100 μs and low ±16 V program/erase. These were achieved using Ge reaction with HfON trapping layer for better charge-trapping and retention.zh_TW
dc.language.isozh_TWen_US
dc.titleFLASH MEMORYzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20130140621zh_TW
Appears in Collections:Patents


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