標題: | STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME |
作者: | CHEN Chih Chang Yuan-Wei |
公開日期: | 25-十月-2012 |
摘要: | A structure for measuring bump resistance and a package substrate comprising the same are disclosed, the structure for measuring bump resistance of the present invention comprises: plural connecting bumps arranged in a row; at least one first connecting element; and at least one second connecting element; wherein the nth connecting bump and the (n+1)th connecting bump connect by the first connecting element, the (n+1)th connecting bump and the (n+2)th connecting bump connect by the second connecting element, n is an odd number of 1 or more; the first connecting element connects with a first voltage-measurement pad; the second connecting element connects with an auxiliary pad, the auxiliary pad connects with an auxiliary bump, a second voltage-measurement pad connects with the auxiliary bump. |
官方說明文件#: | G01R027/14 |
URI: | http://hdl.handle.net/11536/105126 |
專利國: | USA |
專利號碼: | 20120268147 |
顯示於類別: | 專利資料 |