標題: Molding structure with independent thermal control and its molding method
作者: Chen, Ren Haw
Liou, An Cheng
公開日期: 23-Sep-2010
摘要: The present invention, in accordance with the shrinking behavior of heat-melt material during cooling and demolding of molding process, presents a molding structure with electrical heating lines embedded on the surface of the molding structure which allows the structure to provide independent thermal control. By allowing the mold to control its surface temperature, the thermal stress between the heat-melt material and the mold can be eliminated and balanced, thereby preventing the heat-melt material from damage by the gripping force during demolding process.
官方說明文件#: B29C035/00
URI: http://hdl.handle.net/11536/105380
專利國: USA
專利號碼: 20100239701
Appears in Collections:Patents


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