完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Meng, Hsin- Fei | en_US |
dc.contributor.author | Hong, Sheng-Fu | en_US |
dc.contributor.author | Chao, Yu-Chiang | en_US |
dc.contributor.author | Liu, Chien-Cheng | en_US |
dc.contributor.author | Liu, Wen-Hsing | en_US |
dc.contributor.author | Chang, Cheng-Chung | en_US |
dc.contributor.author | Li, Jan-Hao | en_US |
dc.contributor.author | Dai, Ming-Zhi | en_US |
dc.date.accessioned | 2014-12-16T06:15:32Z | - |
dc.date.available | 2014-12-16T06:15:32Z | - |
dc.date.issued | 2010-09-23 | en_US |
dc.identifier.govdoc | G01R019/00 | zh_TW |
dc.identifier.govdoc | H01L029/12 | zh_TW |
dc.identifier.govdoc | H01L051/30 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/105381 | - |
dc.description.abstract | A label-free sensor is disclosed. The label-free sensor comprises a substrate, a first electrode formed on the substrate, a second electrode formed on the substrate and spaced away from the first electrode, and a semiconductor layer formed on the substrate and is in contact with the first electrode and the second electrode, wherein the semiconductor layer has a plurality of probe groups, which are bonded to the semiconductor layer by functionalization, for sensing a coupling-specific substance, which has bonding specificity with the probe groups. The semiconductor layer of the label-free sensor of the present invention is bonded with probe groups, and the detection of detected object is performed in instant, quick, rapid, and sensitive manner by measuring variation in electric current, thereby avoiding the use of the fluorescent reading equipment for reading fluorescent signals. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | LABEL-FREE SENSOR | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20100237885 | zh_TW |
顯示於類別: | 專利資料 |