BUBBLELESS PACKAGING METHOD

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	FAN, Shih-Kang	en_US
dc.contributor.author	Hsu, Ching-Hsiang	en_US
dc.contributor.author	Chiu, Cheng-Pu	en_US
dc.contributor.author	Mo, Chi-Neng	en_US
dc.contributor.author	Chiang, Mei-Tsao	en_US
dc.date.accessioned	2014-12-16T06:15:33Z	-
dc.date.available	2014-12-16T06:15:33Z	-
dc.date.issued	2010-09-16	en_US
dc.identifier.govdoc	B32B037/00	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/105384	-
dc.description.abstract	A bubbleless packaging method is provided. The method is applicable to package a display element. In the method, firstly, a first substrate and a first protective layer are provided. The first protective layer is formed on the first substrate. Then, a second substrate and a second protective layer are provided. The second protective layer is formed on the second substrate. Then, a plasma treatment is performed on surfaces of the first protective layer and the second protective layer. Then, the first substrate and the second substrate are dipped into a solution after the plasma treatment. Then, the first substrate and the second substrate are laminated in the solution, wherein the first protective layer faces the second protective layer. Finally, the first substrate and the second substrate are taken out from the solution.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	BUBBLELESS PACKAGING METHOD	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20100230044	zh_TW
顯示於類別：	專利資料

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