標題: | Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design |
作者: | Lu, Chao-Hung Chen, Hung-Ming Liu, Chien-Nan Jimmy Shih, Wen-Yu 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2009 |
摘要: | Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations affect the performance of the chip and the package significantly. In this paper, we have. developed techniques in chip-package codesign to decide the locations of fingers/pads for package routability and signal integrity concerns in chip core design. Our finger/pad assignment is a two-step method: first we optimize the wire congestion problem in package routing, and then we try to minimize the IR-drop violation with finger/pad solution refinement The experimental results are encouraging. Compared with the randomly optimized methods, our approaches reduce in average 42% and 68% of the maximum density in package and 10.61% of IR-drop for test circuits. |
URI: | http://hdl.handle.net/11536/134412 |
ISBN: | 978-1-4244-3781-8 |
ISSN: | 1530-1591 |
期刊: | DATE: 2009 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, VOLS 1-3 |
起始頁: | 845 |
結束頁: | + |
顯示於類別: | 會議論文 |