標題: Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design
作者: Lu, Chao-Hung
Chen, Hung-Ming
Liu, Chien-Nan Jimmy
Shih, Wen-Yu
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2009
摘要: Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations affect the performance of the chip and the package significantly. In this paper, we have. developed techniques in chip-package codesign to decide the locations of fingers/pads for package routability and signal integrity concerns in chip core design. Our finger/pad assignment is a two-step method: first we optimize the wire congestion problem in package routing, and then we try to minimize the IR-drop violation with finger/pad solution refinement The experimental results are encouraging. Compared with the randomly optimized methods, our approaches reduce in average 42% and 68% of the maximum density in package and 10.61% of IR-drop for test circuits.
URI: http://hdl.handle.net/11536/134412
ISBN: 978-1-4244-3781-8
ISSN: 1530-1591
期刊: DATE: 2009 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, VOLS 1-3
起始頁: 845
結束頁: +
顯示於類別:會議論文