Method for forming required pattern on semiconductor substrate by thermal reflow technique

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DC Field	Value	Language
dc.contributor.author	Chang, Yi Edward	en_US
dc.contributor.author	Chang, Chia-Ta	en_US
dc.contributor.author	Hsiao, Shih-Kuang	en_US
dc.date.accessioned	2014-12-16T06:15:34Z	-
dc.date.available	2014-12-16T06:15:34Z	-
dc.date.issued	2010-06-24	en_US
dc.identifier.govdoc	H01L021/3065	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/105397	-
dc.description.abstract	The invention is disclosed that pattern on semiconductor substrate is fabricated by thermal reflow technique. Also, the pattern on semiconductor substrate having different sub-micron spacings can be fabricated by using different time for the thermal reflow technique process.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Method for forming required pattern on semiconductor substrate by thermal reflow technique	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20100159708	zh_TW
Appears in Collections:	Patents

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