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dc.contributor.authorCHIOU, Jin-Chernen_US
dc.contributor.authorHUNG, Chen-Chunen_US
dc.contributor.authorCHANG, Chih-Weien_US
dc.date.accessioned2014-12-16T06:15:57Z-
dc.date.available2014-12-16T06:15:57Z-
dc.date.issued2008-07-03en_US
dc.identifier.govdocB29C033/40zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105589-
dc.description.abstractThe present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.zh_TW
dc.language.isozh_TWen_US
dc.titleMETHOD FOR FABRICATING MICRONEEDLE ARRAY AND METHOD FOR FABRICATING EMBOSSING MOLD OF MICRONEEDLE ARRAYzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20080157427zh_TW
Appears in Collections:Patents


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