1. 目前位置：

完整後設資料紀錄
DC 欄位值語言
dc.contributor.authorCHIOU, Jin-Chernen_US
dc.contributor.authorHUNG, Chen-Chunen_US
dc.contributor.authorCHANG, Chih-Weien_US
dc.date.accessioned2014-12-16T06:15:57Z-
dc.date.available2014-12-16T06:15:57Z-
dc.date.issued2008-07-03en_US
dc.identifier.govdocB29C033/40zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105589-
dc.description.abstractThe present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.zh_TW
dc.language.isozh_TWen_US
dc.titleMETHOD FOR FABRICATING MICRONEEDLE ARRAY AND METHOD FOR FABRICATING EMBOSSING MOLD OF MICRONEEDLE ARRAYzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20080157427zh_TW
顯示於類別：專利資料


文件中的檔案：

  1. 20080157427.pdf

若為 zip 檔案，請下載檔案解壓縮後，用瀏覽器開啟資料夾中的 index.html 瀏覽全文。

相關內容
Loading...