完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | Whang, Wha-tzong | en_US |
| dc.contributor.author | Hsiao, Yu-sheng | en_US |
| dc.date.accessioned | 2014-12-16T06:16:03Z | - |
| dc.date.available | 2014-12-16T06:16:03Z | - |
| dc.date.issued | 2007-10-11 | en_US |
| dc.identifier.govdoc | H01L021/28 | zh_TW |
| dc.identifier.govdoc | B32B017/06 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/105632 | - |
| dc.description.abstract | A method for manufacturing a surface-metallized polyimide material includes performing an alkaline treatment on a surface of a polyimide material to cause ring opening of the polyimide material on the surface; the surface of the polyimide material being subject to an ion exchange process for being displaced by a first metal ion exclusive of palladium ion, gold ion, silver ion, and copper ion; and performing a wet reduction process to reduce the first metal ion on the surface of the polyimide material into a first metal that adheres to the surface of the polyimide material. A surface-metallized polyimide material produced according to the aforementioned method is also disclosed. | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | Surface-metallized polyimide material and method for manufacturing the same | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20070237969 | zh_TW |
| 顯示於類別: | 專利資料 | |

