標題: | Soft-mold-induced self-construction of polymer patterns under microwave irradiation |
作者: | Ko, Fu-Hsiang Wu, Chia-Tien Chen, Mei-Fen Chen, Jem-Kun Chu, Tieh-Chi 材料科學與工程學系 材料科學與工程學系奈米科技碩博班 Department of Materials Science and Engineering Graduate Program of Nanotechnology , Department of Materials Science and Engineering |
公開日期: | 7-May-2007 |
摘要: | In this study, the authors used a soft-mold-induced self-construction method to fabricate three-dimensional patterns under microwave irradiation for 1 min. The authors estimated the actual pattern growth temperature using a fluorescence probe technique. The temperature at which pattern growth originated was, by necessity, higher than the glass transition temperature of the novolak resist. Electrostatic forces and surface tension effects under the electromagnetic field contributed significantly to the pattern growth, and the use of an antisticking agent allowed easy demolding. (C) 2007 American Institute of Physics. |
URI: | http://dx.doi.org/10.1063/1.2737364 http://hdl.handle.net/11536/10809 |
ISSN: | 0003-6951 |
DOI: | 10.1063/1.2737364 |
期刊: | APPLIED PHYSICS LETTERS |
Volume: | 90 |
Issue: | 19 |
結束頁: | |
Appears in Collections: | Articles |
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