標題: Soft-mold-induced self-construction of polymer patterns under microwave irradiation
作者: Ko, Fu-Hsiang
Wu, Chia-Tien
Chen, Mei-Fen
Chen, Jem-Kun
Chu, Tieh-Chi
材料科學與工程學系
材料科學與工程學系奈米科技碩博班
Department of Materials Science and Engineering
Graduate Program of Nanotechnology , Department of Materials Science and Engineering
公開日期: 7-May-2007
摘要: In this study, the authors used a soft-mold-induced self-construction method to fabricate three-dimensional patterns under microwave irradiation for 1 min. The authors estimated the actual pattern growth temperature using a fluorescence probe technique. The temperature at which pattern growth originated was, by necessity, higher than the glass transition temperature of the novolak resist. Electrostatic forces and surface tension effects under the electromagnetic field contributed significantly to the pattern growth, and the use of an antisticking agent allowed easy demolding. (C) 2007 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2737364
http://hdl.handle.net/11536/10809
ISSN: 0003-6951
DOI: 10.1063/1.2737364
期刊: APPLIED PHYSICS LETTERS
Volume: 90
Issue: 19
結束頁: 
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