完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Ker, Ming-Dou | en_US |
dc.contributor.author | Chang, Wei-Jen | en_US |
dc.date.accessioned | 2014-12-08T15:14:59Z | - |
dc.date.available | 2014-12-08T15:14:59Z | - |
dc.date.issued | 2007-01-01 | en_US |
dc.identifier.issn | 0026-2714 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1016/j.microrel.2006.03.012 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/11272 | - |
dc.description.abstract | Electrostatic discharge (ESD) protection design for mixed-voltage I/O interfaces has been one of the key challenges of system-on-achip (SOC) implementation in nanoscale CMOS processes. The on-chip ESD protection circuit for mixed-voltage I/O interfaces should meet the gate-oxide reliability constraints and prevent the undesired leakage current paths. This paper presents all overview on the design concept and circuit implementations of ESD protection designs for mixed-voltage I/O interfaces with only low-voltage thin-oxide CMOS transistors. Especially, the ESD protection designs for mixed-voltage I/O interfaces with ESD bus and high-voltage-tolerant power-rail ESD clamp circuits are presented and discussed. (c) 2006 Elsevier Ltd. All rights reserved. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Overview on ESD protection design for mixed-voltage I/O interfaces with high-voltage-tolerant power-rail ESD clamp circuits in low-voltage thin-oxide CMOS technology | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1016/j.microrel.2006.03.012 | en_US |
dc.identifier.journal | MICROELECTRONICS RELIABILITY | en_US |
dc.citation.volume | 47 | en_US |
dc.citation.issue | 1 | en_US |
dc.citation.spage | 27 | en_US |
dc.citation.epage | 35 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000244006500004 | - |
dc.citation.woscount | 4 | - |
顯示於類別: | 期刊論文 |