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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChang, Wei-Jenen_US
dc.date.accessioned2014-12-08T15:14:59Z-
dc.date.available2014-12-08T15:14:59Z-
dc.date.issued2007-01-01en_US
dc.identifier.issn0026-2714en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.microrel.2006.03.012en_US
dc.identifier.urihttp://hdl.handle.net/11536/11272-
dc.description.abstractElectrostatic discharge (ESD) protection design for mixed-voltage I/O interfaces has been one of the key challenges of system-on-achip (SOC) implementation in nanoscale CMOS processes. The on-chip ESD protection circuit for mixed-voltage I/O interfaces should meet the gate-oxide reliability constraints and prevent the undesired leakage current paths. This paper presents all overview on the design concept and circuit implementations of ESD protection designs for mixed-voltage I/O interfaces with only low-voltage thin-oxide CMOS transistors. Especially, the ESD protection designs for mixed-voltage I/O interfaces with ESD bus and high-voltage-tolerant power-rail ESD clamp circuits are presented and discussed. (c) 2006 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleOverview on ESD protection design for mixed-voltage I/O interfaces with high-voltage-tolerant power-rail ESD clamp circuits in low-voltage thin-oxide CMOS technologyen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.microrel.2006.03.012en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.citation.volume47en_US
dc.citation.issue1en_US
dc.citation.spage27en_US
dc.citation.epage35en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000244006500004-
dc.citation.woscount4-
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