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dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.authorYou, Hsin-Chiangen_US
dc.contributor.authorChang, Chun-Mingen_US
dc.contributor.authorYang, Wen-Luhen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:15:05Z-
dc.date.available2014-12-08T15:15:05Z-
dc.date.issued2007en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/11331-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2433705en_US
dc.description.abstractWe fabricated the binary high-k (HfxZr1-xO2) nanocrystal memory using a very simple sol-gel spin coating method and 900 degrees C 60 s rapid thermal annealing (RTA). From the transmission electron microscopy identification, the nanocrystals were formed as the monolayered charge trapping site after 900 degrees C 60 s RTA and the size was ca. 5 nm. We verified the electrical properties in terms of program-erase speed, charge retention, and endurance. The sol-gel device exhibited the long charge retention time of 10(4) s with only 2.5% charge loss, and good endurance performance for program/erase cycles up to 10(5). (c) 2007 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleFabrication of SONOS-type flash memory with the binary high-k dielectrics by the sol-gel spin coating methoden_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2433705en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume154en_US
dc.citation.issue4en_US
dc.citation.spageH268en_US
dc.citation.epageH270en_US
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000244792200059-
dc.citation.woscount4-
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