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dc.contributor.authorHo, Chia-Chengen_US
dc.contributor.authorChiou, Bi-Shiouen_US
dc.contributor.authorChang, Li-Chunen_US
dc.contributor.authorChou, Chen-Chiaen_US
dc.contributor.authorLiou, Bo-Hengen_US
dc.contributor.authorYu, Chin-Chiehen_US
dc.date.accessioned2014-12-08T15:15:12Z-
dc.date.available2014-12-08T15:15:12Z-
dc.date.issued2006-12-20en_US
dc.identifier.issn0257-8972en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.surfcoat.2006.08.024en_US
dc.identifier.urihttp://hdl.handle.net/11536/11426-
dc.description.abstractA novel sandwich structure of Ba0.7Sr0.3TiO3/Cr/Ba0.7Sr0.3TiO3 (BST/Cr/BST) was sputtered onto Pt/Ti/SiO2/Si substrate. With the insertion of a Cr layer, the leakage currents are decreased and the thermal stability of the specimens is enhanced. Temperature coefficient of capacitance (TCC) of specimens with BST(200 nm)/Cr(2 nm)/BST(200 nm) multifilms can achieve about 83% lower than those with BST (400 nm) monolayer. However, the dielectric constant of the BST(200 nm)/Cr(2 nm)/BST(200 nm) multifilms decreases to about 37% of that BST monolayer. The leakage current densities under an electric field of 125 kV/cm at 90 degrees C are 4 x 10(-4) A/cm(2) and 9 x 10(-1) A/cm(2) for BST(200 nm)/Cr(2 nm)/BST(200 nm) and monolayer BST (400 nm), respectively. X-ray diffraction results indicate the formation of a CrO3 secondary phase after annealing at 700 degrees C or above in O-2 atmosphere. The root causes for the improvement of leakage currents and thermal stability with the insertion of nano-Cr interlayer are explored. The results show the insertion of Cr-nanolayer improves the electric properties for application in capacitors. (c) 2006 Elsevier B.V All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectBST thin filmsen_US
dc.subjectferroelectricen_US
dc.subjectthermal stabilityen_US
dc.subjectcapacitoren_US
dc.titleThermal stability and electric properties of Ba0.7Sr0.3TiO3 parallel plate capacitor with nano-Cr interlayeren_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.surfcoat.2006.08.024en_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.citation.volume201en_US
dc.citation.issue7en_US
dc.citation.spage4163en_US
dc.citation.epage4167en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentInnovative Packaging Research Centerzh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInnovative Packaging Research Centeren_US
dc.identifier.wosnumberWOS:000243149700064-
Appears in Collections:Conferences Paper


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