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dc.contributor.authorMeng, Hsin-Feien_US
dc.contributor.authorLiu, Chien-Chengen_US
dc.contributor.authorJiang, Chin-Jungen_US
dc.contributor.authorYeh, Yu-Linen_US
dc.contributor.authorHorng, Sheng-Fuen_US
dc.contributor.authorHsu, Chain-Shuen_US
dc.date.accessioned2014-12-08T15:15:13Z-
dc.date.available2014-12-08T15:15:13Z-
dc.date.issued2006-12-11en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2403921en_US
dc.identifier.urihttp://hdl.handle.net/11536/11440-
dc.description.abstractPoly(3-hexylthiophene) (P3HT) field-effect transistors (FETs) are fabricated on glass substrates with SiO2 as a gate dielectric over the gate. Indium tin oxide (ITO), Al, and Cr are employed as gate metals. For spin-coated FET, the mobility increases from 10(-4)-10(-5) cm(2)/V s for ITO and Al gates to 10(-2) cm(2)/V s for Cr gate. After O-2 plasma treatment, the SiO2 roughness can be made as low as 0.7 nm. The mobility is further improved up to 0.3 cm(2)/V s by dip-coating P3HT. "Crossed rods" such as morphology can be observed in dip-coated FET with high mobility, indicating high degree of self-assembly facilitated by the flat SiO2 surface over Cr gate. (c) 2006 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleEffect of gate metal on polymer transistor with glass substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2403921en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume89en_US
dc.citation.issue24en_US
dc.citation.epageen_US
dc.contributor.department應用化學系zh_TW
dc.contributor.department物理研究所zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.contributor.departmentInstitute of Physicsen_US
dc.identifier.wosnumberWOS:000242886500124-
dc.citation.woscount8-
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