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dc.contributor.authorChin, Aen_US
dc.contributor.authorLee, KYen_US
dc.contributor.authorLin, BCen_US
dc.contributor.authorHorng, Sen_US
dc.date.accessioned2014-12-08T15:02:29Z-
dc.date.available2014-12-08T15:02:29Z-
dc.date.issued1996-07-29en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://hdl.handle.net/11536/1155-
dc.description.abstractPicosecond photoresponse of carriers in Si ion-implanted Si samples has been measured using femtosecond transient reflectivity measurement. A threshold peak implant dose of 10(16) cm(-2) is required to achieve picosecond carrier lifetime. At this dosage, carrier lifetimes of 0.9 and 1.4 ps are measured for the as-implanted and 400 degrees C annealed Si substrates, respectively. The increase in carrier lifetime upon annealing is attributed to the reduction in the concentration of trap and recombination centers. Sheet resistance also shows a strong dependence on the annealing temperature. An eightfold increase in sheet resistance is obtained for annealed samples, and a reduction in hopping conduction, manifested by the e(-1/T) temperature dependence, may be responsible for the increase in resistance. Further evidence of decreasing hopping conduction can be also observed from the more than two orders of magnitude in reduction of sheet resistance as the peak dosage decreases from 10(16) to 10(14) cm(-2). (C) 1996 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titlePicosecond photoresponse of carriers in Si ion-implanted Sien_US
dc.typeArticleen_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume69en_US
dc.citation.issue5en_US
dc.citation.spage653en_US
dc.citation.epage655en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1996UZ02400021-
dc.citation.woscount62-
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