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dc.contributor.authorLin, Shin-Yeuen_US
dc.contributor.authorHorng, Shih-Chengen_US
dc.date.accessioned2014-12-08T15:15:30Z-
dc.date.available2014-12-08T15:15:30Z-
dc.date.issued2006-11-01en_US
dc.identifier.issn1083-4427en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TSMCA.2006.878965en_US
dc.identifier.urihttp://hdl.handle.net/11536/11596-
dc.description.abstractIn this correspondence, we have formulated a stochastic optimization problem to find the optimal threshold values to reduce the overkills of dies under a tolerable retest level in wafer testing process. The problem is a hard optimization problem with a huge solution space. We propose an ordinal optimization theory-based two-level algorithm to solve for a vector of good enough threshold values and compare with those obtained by others using a set of 521 real test wafers. The test results confirm the feature of controlling the retest level in our formulation, and the pairs of overkills and retests resulted from our approach are almost Pareto optimal. In addition, our approach spends only 6.05 min in total in a Pentium IV personal computer to obtain the good enough threshold values.en_US
dc.language.isoen_USen_US
dc.subjectgenetic algorithm (GA)en_US
dc.subjectneural networken_US
dc.subjectordinal optimization (OO)en_US
dc.subjectoverkillen_US
dc.subjectretesten_US
dc.subjectstochastic optimizationen_US
dc.subjectwafer probingen_US
dc.titleApplication of an ordinal optimization algorithm to the wafer testing processen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TSMCA.2006.878965en_US
dc.identifier.journalIEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICS PART A-SYSTEMS AND HUMANSen_US
dc.citation.volume36en_US
dc.citation.issue6en_US
dc.citation.spage1229en_US
dc.citation.epage1234en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:000241438600019-
dc.citation.woscount13-
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