標題: Reducing the overkills and retests in wafer testing process
作者: Horng, SC
Lin, SY
Cheng, MH
Yang, FY
Liu, CH
Lee, WY
Tsai, CH
電機學院
College of Electrical and Computer Engineering
關鍵字: wafer testing;overkill;retest;stochastic optimization;ordinal optimization
公開日期: 2003
摘要: Reducing overkills is one of the main objectives in wafer testing process, however the major mean to prevent overkills is retest. In this paper, we formulate the problem of reducing overkills and retests as a stochastic optimization problem to determine optimal threshold values concerning the number of good dies and the number of bins in a lot and wafer to decide whether to go for a retest after a regular wafer probing. The considered stochastic optimization problem is an NP hard problem. We propose an Ordinal Optimization theory based two-level method to solve the problem for good enough threshold values to achieve lesser overkills and retests within a reasonable computational time. Applying to a case based on the true mean of bins of a real semiconductor product, the threshold values we obtained are the best among 1000 sets of randomly generated threshold values in the sense of lesser overkills under a tolerable retest rate.
URI: http://hdl.handle.net/11536/18433
http://dx.doi.org/10.1109/ASMC.2003.1194508
ISBN: 0-7803-7673-0
ISSN: 1078-8743
DOI: 10.1109/ASMC.2003.1194508
期刊: ASCMC 2003: IEEE/SEMI (R) ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, PROCEEDINGS
起始頁: 286
結束頁: 291
顯示於類別:會議論文


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