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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChen, Wen-Yien_US
dc.contributor.authorHsu, Kuo-Chunen_US
dc.date.accessioned2014-12-08T15:15:40Z-
dc.date.available2014-12-08T15:15:40Z-
dc.date.issued2006-10-01en_US
dc.identifier.issn1057-7122en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCSI.2006.882818en_US
dc.identifier.urihttp://hdl.handle.net/11536/11699-
dc.description.abstractA new power-rail electrostatic discharge (ESD) clamp circuit for application in 3.3-V mixed-voltage input-output (I/O) interface is proposed and verified in a 130-nm 1-V/2.5-V CMOS process. The devices in this power-rail ESD clamp circuit are all 1-V or 2.5-V low-voltage nMOS/pMOS devices, which are specially designed without suffering the gate-oxide reliability issue under 3.3-V I/O interface applications. A special ESD detection circuit realized with the low-voltage devices is designed and added in the power-rail ESD clamp circuit to improve ESD robustness of ESD clamp devices by substrate-triggered technique. The experimental results verified in a 130-nm CMOS process have proven the excellent effectiveness of this new proposed power-rail ESD clamp circuit.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectESD protection circuiten_US
dc.subjecthigh-voltage toleranten_US
dc.subjectpower-rail ESD clamp circuiten_US
dc.subjectsubstrate-triggered techniqueen_US
dc.titleDesign on power-rail ESD clamp circuit for 3.3-V I/O interface by using only 1-V/2.5-V low-voltage devices in a 130-nm CMOS processen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCSI.2006.882818en_US
dc.identifier.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERSen_US
dc.citation.volume53en_US
dc.citation.issue10en_US
dc.citation.spage2187en_US
dc.citation.epage2193en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000241391700009-
dc.citation.woscount4-
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