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dc.contributor.authorHuang, C. C.en_US
dc.contributor.authorChiang, K. C.en_US
dc.contributor.authorKao, H. L.en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorChen, W. J.en_US
dc.date.accessioned2014-12-08T15:15:53Z-
dc.date.available2014-12-08T15:15:53Z-
dc.date.issued2006-09-01en_US
dc.identifier.issn1531-1309en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LMWC.2006.880709en_US
dc.identifier.urihttp://hdl.handle.net/11536/11866-
dc.description.abstractA very high density of 35 fF/mu m(2) is measured in a radio frequency (RF) metal-insulator-metal (MIM) capacitor using high-kappa (kappa = 169) SrTiO3 fabricated by very large scale integration (VLSI) back-end integration. A very small capacitance reduction of 4.1% from 100 kHz to 10 GHz, low leakage current of 1 X 10(-7) A/cm(2) at 1 V are simultaneously measured. The small voltage dependence of a capacitance Delta C/C of 637 ppm is also obtained at 2 GHz, which ensures this MIM capacitor useful for high precision circuits operated at a RF regime.en_US
dc.language.isoen_USen_US
dc.subjectcapacitoren_US
dc.subjectInternational Technology Roadmap for Semiconductors (ITRS)en_US
dc.subjectmetal-insulator-metal (MIM)en_US
dc.subjectradio frequency integrated circuit (RF IC)en_US
dc.subjectSrTiO3en_US
dc.titleRFIC TaN/SrTio(3)/TaN MIM capacitors with 35 fF/mu m(2) capacitance densityen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LMWC.2006.880709en_US
dc.identifier.journalIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERSen_US
dc.citation.volume16en_US
dc.citation.issue9en_US
dc.citation.spage493en_US
dc.citation.epage495en_US
dc.contributor.department奈米科技中心zh_TW
dc.contributor.departmentCenter for Nanoscience and Technologyen_US
dc.identifier.wosnumberWOS:000240446000005-
dc.citation.woscount6-
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