完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chen, WZ | en_US |
dc.contributor.author | Lu, CH | en_US |
dc.date.accessioned | 2014-12-08T15:16:38Z | - |
dc.date.available | 2014-12-08T15:16:38Z | - |
dc.date.issued | 2006-05-01 | en_US |
dc.identifier.issn | 1057-7122 | en_US |
dc.identifier.uri | http://dx.doi.org/10.2116/analsci.22.977 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/12272 | - |
dc.description.abstract | This paper presents the design of an optical receiver analog front-end circuit capable of operating at 2.5 Gbit/s. Fabricated in a low-cost 0.35-mu m digital CMOS process, this integrated circuit integrates both transimpedance amplifier and post limiting amplifier on a single chip. In order to facilitate high-speed operations in a low-cost CMOS technology, the receiver front-end has been designed utilizing several enhanced bandwidth techniques, including inductive peaking and current injection. Moreover, a power optimization methodology for a multistage wide band amplifier has been proposed. The measured input-referred noise of the optical receiver is about 0.8 mu A(rms). The input sensitivity of the receiver front-end is 16 mu A for 2.5-Gbps operation with bit-error rate less than 10(-12), and the output swing is about 250 mV (single-ended). The front-end circuit drains a total current of 33 mA from a 3-V supply. Chip size is 1650 mu m x 1500 mu m. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | active inductor | en_US |
dc.subject | limiting amplifier (LA) | en_US |
dc.subject | transimpedance amplifier (TIA) | en_US |
dc.title | Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-mu m digital CMOS technology | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.2116/analsci.22.977 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS | en_US |
dc.citation.volume | 53 | en_US |
dc.citation.issue | 5 | en_US |
dc.citation.spage | 977 | en_US |
dc.citation.epage | 983 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Innovative Packaging Research Center | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.contributor.department | Innovative Packaging Research Center | en_US |
dc.identifier.wosnumber | WOS:000237524100002 | - |
dc.citation.woscount | 24 | - |
顯示於類別: | 期刊論文 |