標題: On-chip electronic device and method for manufacturing the same
作者: Cheng Yu-Ting
Chao Tzu-Yuan
Chen Kuan-Ming
Hsu Hsin-Fu
公開日期: 17-二月-2015
摘要: The present invention relates to an on-chip electronic device and a method for manufacturing the same. The on-chip electronic device according to the present invention comprises a substrate, a porous layer, a plurality of magnetic bodies, and an electronic member layer. The porous layer is disposed on the substrate and has a plurality of voids; each of the plurality of magnetic bodies is disposed in the plurality of voids, respectively; and the electronic member layer is disposed on one side of the porous layer, such as upper side of or lower sider of the porous layer. Because the plurality of magnetic bodies is used as the core of the inductance, the inductance is increased effectively and the area of the on-chip electronic device is reduced. Besides the manufacturing method according to the present invention is simple and compatible with the current CMOS process, the manufacturing cost can be lowered.
官方說明文件#: H01L027/08
H01L049/02
H01L023/522
H01L023/532
URI: http://hdl.handle.net/11536/122817
專利國: USA
專利號碼: 08957498
顯示於類別:專利資料


文件中的檔案:

  1. 08957498.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。