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dc.contributor.author郭柏儀en_US
dc.contributor.author趙天生en_US
dc.contributor.author呂宜憲en_US
dc.date.accessioned2015-05-12T03:00:01Z-
dc.date.available2015-05-12T03:00:01Z-
dc.date.issued2015-01-01en_US
dc.identifier.govdocH01L021/336zh_TW
dc.identifier.govdocH01L021/311zh_TW
dc.identifier.govdocH01L029/78zh_TW
dc.identifier.govdocH01L029/06zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/122938-
dc.description.abstract本發明提供具有奈米線通道之半導體元件的製程,包含:於基材上形成包含第一矽酸四乙酯氧化層、第一中間材料層與第二矽酸四乙酯氧化層的堆疊結構。圖案化堆疊結構以定義出通道區。移除通道區內部分之第一中間材料層以使通道區內之堆疊結構側邊具有凹槽。形成半導體層於基材與堆疊結構上並填入凹槽。圖案化半導體層以定義出源極區與汲極區,且通道區位於源極區與汲極區間並部分重疊。移除位於源極區、汲極區與凹槽外之半導體層。移除堆疊結構以暴露凹槽內之半導體層而形成通道。形成閘極氧化層包覆通道。形成閘極層於閘極氧化層上。zh_TW
dc.language.isozh_TWen_US
dc.title具有奈米線通道之半導體元件的製程及藉此形成之半導體元件zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI467666zh_TW
Appears in Collections:Patents


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