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dc.contributor.authorLu, Ching-Senen_US
dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorChen, Ying-Hungen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.date.accessioned2014-12-08T15:16:49Z-
dc.date.available2014-12-08T15:16:49Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0584-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/12368-
dc.description.abstractAlthough a compressive SiN capping could effectively boost the drive current of PMOS devices, it may concomitantly worsen the NBTI characteristics owing to the high hydrogen content in the SiN layer which might diffuse to the channel region during processing. To address this issue, inserting a thin 3nm HfO2 buffer layer between the gate and SiN capping is proposed and demonstrated to improve NBTI reliability without sacrificing the performance enhancement by SiN capping.en_US
dc.language.isoen_USen_US
dc.titleImproved NBTI in SiN-capped PMOSFETs with ultra-thin HfO2 bufferen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Proceedings of Technical Papersen_US
dc.citation.spage54en_US
dc.citation.epage55en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247059300025-
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