標題: | Extremely anisotropic single-crystal growth in nanotwinned copper |
作者: | Lu, Chia-Ling Lin, Han-Wen Liu, Chien-Min Huang, Yi-Sa Lu, Tien-Lin Liu, Tao-Chi Hsiao, Hsiang-Yao Chen, Chih Kuo, Jui-Chao Tu, King-Ning 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 1-十月-2014 |
摘要: | By electroplating of nearly unidirectionally < 111 >-oriented nanotwinned and fine-grained Cu on a Si wafer surface followed by annealing at 400-500 degrees C for up to 1 h, we grew many extremely large < 100 >-oriented single crystals of Cu with sizes ranging from 200 to 400 mu m. By patterning and annealing the nanotwinned Cu films, we grew an array of < 100 >-oriented single crystals of Cu with sizes ranging from 25 to 100 mu m on Si. In comparison, single-crystal nano-wire growth is a one-dimensional anisotropic growth process, in which the growth along the axial direction is much faster than in the radial direction. We report here a bulk-type two-dimensional crystal growth of an array of numerous < 100 >-oriented single crystals of Cu on Si. This growth process has the potential for microbump applications in three-dimensional integrated circuit-packaging technology for hand-held consumer electronic products. |
URI: | http://dx.doi.org/10.1038/am.2014.90 http://hdl.handle.net/11536/123977 |
ISSN: | 1884-4049 |
DOI: | 10.1038/am.2014.90 |
期刊: | NPG ASIA MATERIALS |
顯示於類別: | 期刊論文 |