標題: | A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate |
作者: | Fu, Yu-Min Liang, Yen R. Cheng, Yu-Ting Wu, Pu-Wei 材料科學與工程學系 電子工程學系及電子研究所 Department of Materials Science and Engineering Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Flexible electronics;flexible inkjet printing;inductor;printed microsystems |
公開日期: | 1-四月-2015 |
摘要: | In this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 mu m and resistivities of similar to 9.8 mu Omega . cm on a flexible polyimide substrate via thermal sintering at 300 degrees C for 30 min. In addition, a printed interdigitated capacitor with an electrode line width and spacing of 10 mu m and a printed spiral square inductor with a 10-mu m line width and 5-mu m spacing in an area of 1 mm(2) have been successfully demonstrated with an area capacitance and inductance of 0.43 pF/mm(2) at 10 KHz and 1.054 mu H/mm(2) up to 100 KHz, respectively, which are the orders of magnitude performance improvement in comparison with the contemporary inkjet-printed capacitors and inductors. Owing to the significant reduction of energy demand in processing tools and waste generation in processing materials, the results have revealed that the CPLoP process can facilitate the advancement of printing manufacture technology for microelectronics applications. |
URI: | http://dx.doi.org/10.1109/TED.2015.2401599 http://hdl.handle.net/11536/124475 |
ISSN: | 0018-9383 |
DOI: | 10.1109/TED.2015.2401599 |
期刊: | IEEE TRANSACTIONS ON ELECTRON DEVICES |
Volume: | 62 |
起始頁: | 1248 |
結束頁: | 1254 |
顯示於類別: | 期刊論文 |