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dc.contributor.authorLu, CYen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:17:35Z-
dc.date.available2014-12-08T15:17:35Z-
dc.date.issued2006en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/12755-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2173189en_US
dc.description.abstractynamic negative bias temperature instability (DNBTI) characteristics of p-metal oxide semiconductor field-effect transistors (p-MOSFETs) with compressive channel strain induced by a SiN-capping layer were investigated. Although the SiN-capping is effective in boosting the device drive current, it may concomitantly worsen DNBTI characteristics. This is ascribed to higher hydrogen content incorporated during SiN deposition as well as higher strain energy stored in the channel. A strong dependence on the ac stress frequency is also observed for the SiN-capped devices, which is ascribed to excess hydrogen species contained in the strained devices. Finally, our experimental results also suggest that the aggravated NBTI in the strained devices could be alleviated by high frequency operation. (c) 2006 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleImpacts of uniaxial compressive strain on dynamic negative bias temperature instability of p-channel MOSFETsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2173189en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume9en_US
dc.citation.issue4en_US
dc.citation.spageG138en_US
dc.citation.epageG140en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000235479800026-
dc.citation.woscount7-
Appears in Collections:Articles