Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 潘麒文 | en_US |
dc.contributor.author | Pan, Chi-Wen | en_US |
dc.contributor.author | 李育民 | en_US |
dc.contributor.author | Lee, Yu-Min | en_US |
dc.date.accessioned | 2015-11-26T01:02:46Z | - |
dc.date.available | 2015-11-26T01:02:46Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.uri | http://140.113.39.130/cdrfb3/record/nctu/#GT079713560 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/127629 | - |
dc.language.iso | en_US | en_US |
dc.subject | 三維積體電路 | zh_TW |
dc.subject | 手持裝置 | zh_TW |
dc.subject | 熱分析 | zh_TW |
dc.subject | 智慧型手機 | zh_TW |
dc.subject | 高效率 | zh_TW |
dc.subject | 熱模型 | zh_TW |
dc.subject | 3-D IC | en_US |
dc.subject | Handheld Device | en_US |
dc.subject | Thermal Analysis | en_US |
dc.subject | Smartphone | en_US |
dc.subject | High Efficiency | en_US |
dc.subject | Thermal Model | en_US |
dc.title | 三維積體電路與手持裝置之熱分析技術 | zh_TW |
dc.title | Thermal Analysis Techniques for 3-D Integrated Circuits and Handheld Devices | en_US |
dc.type | Thesis | en_US |
dc.contributor.department | 電信工程研究所 | zh_TW |
Appears in Collections: | Thesis |