三維積體電路與手持裝置之熱分析技術

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	潘麒文	en_US
dc.contributor.author	Pan, Chi-Wen	en_US
dc.contributor.author	李育民	en_US
dc.contributor.author	Lee, Yu-Min	en_US
dc.date.accessioned	2015-11-26T01:02:46Z	-
dc.date.available	2015-11-26T01:02:46Z	-
dc.date.issued	2015	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#GT079713560	en_US
dc.identifier.uri	http://hdl.handle.net/11536/127629	-
dc.language.iso	en_US	en_US
dc.subject	三維積體電路	zh_TW
dc.subject	手持裝置	zh_TW
dc.subject	熱分析	zh_TW
dc.subject	智慧型手機	zh_TW
dc.subject	高效率	zh_TW
dc.subject	熱模型	zh_TW
dc.subject	3-D IC	en_US
dc.subject	Handheld Device	en_US
dc.subject	Thermal Analysis	en_US
dc.subject	Smartphone	en_US
dc.subject	High Efficiency	en_US
dc.subject	Thermal Model	en_US
dc.title	三維積體電路與手持裝置之熱分析技術	zh_TW
dc.title	Thermal Analysis Techniques for 3-D Integrated Circuits and Handheld Devices	en_US
dc.type	Thesis	en_US
dc.contributor.department	電信工程研究所	zh_TW
顯示於類別：	畢業論文