标题: 软性电子错误之进阶效应分析-从元件层级到电路层级
Soft Error Analysis of VLSI Designs considering Advanced Effects – from Device to Circuit Level
作者: 黄宣铭
Huang, Hsuan-Ming
温宏斌
电机工程学系
关键字: 软性电子错误;可靠度分析;soft error;reliability
公开日期: 2015
摘要: 随着制程不断的缩小,针对产品可靠度的议题显得更富有可挑战性。在电路上会有发生错误的可能,我们将错误主要归为两类,一类为不可逆不可变的永久性错误,而另一类为有时发生有时不发生的暂态错误。在这深次微米技术的时代里,由于环境中的宇宙射线,深深地影响了半导体产品的可靠度。导致软性错误已经成为先进制程中对于错误发生率不可忽视且有着举足轻重地位的电子特性之一了。

在先前的制程技术中,软性电子错误率对于记忆体设计的影响比较大,但当制程若缩小至100 奈米以下,逻辑电路将再也不能忽视软性电子错误的重要性了。因此,在这篇论文中,我们首先在元件层级分析了在深次微米下各种软性电子错误中的进阶效应,包含了粒子击中时间、多周期效应、多暂态错误效应以及考虑动态电压之影响,并且在电路层级中,对于每种效应提出了相对应的软性电子错误估算平台。实验结果显示,如果不考虑粒子击中时间和多周期效应的话,将会有38.45%的误差,再者,如果忽略了多暂态错误效应的话,将会有16%的误差,最后,如果只考虑静态的电压的话,所估计之收集电荷数将会比考虑动态电压多出50%。总结来说,如果忽略了以上所提及之效应的话,将会导致软性电子错误估算有着严重的偏差。
Along with technology scaling, circuit reliability is becoming more challenging than ever. Errors that jeopardize circuit reliability can be classified based on their occurrences in different operating scenarios into (1) permanent faults which are associated with permanent damages to the device and (2) transient faults which appear under temporary scenarios. Beyond deep sub-micron era, environmental radiation results in more impact on semiconductor devices. Soft errors have emerged to be one of the dominant failure mechanisms in modern CMOS technologies.
Concerns with soft errors appearing in memory units have been discussed for a period of time. However, as process technology scales below 100 nm and operating frequencies increase, soft errors are also becoming a commonplace for logic circuits as well. Hence, in this dissertation, we first analyze some advanced soft error effects, including the striking time and multi-cycle effects, multiple transient faults effect and dynamic voltage effect, on soft error estimation in device level. A series of frameworks were proposed to accurately and efficiently compute the soft error rate considering each effect in circuit level. Experimental results show that it vital to consider all of the effects otherwise significant inaccuracies will be introduced. Compared with the soft error estimation with and without striking time and multi-cycle effects, the soft error difference is 38.45% in average. Neglecting multiple transient faults effect will cause 16% of underestimation in soft error estimation. The estimation for collected charge will be 50% more pessimistic if the dynamic voltage effect is ignored.
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT070080702
http://hdl.handle.net/11536/127711
显示于类别:Thesis