標題: Numerical and model predictions of the thermal conductivity of bismuth telluride nanoprism-assembled films
作者: Hou, Yi-Cheng
Huang, Mei-Jiau
Chuang, Pi-Yueh
Chang, Hsiu-Cheng
Chen, Chun-Hua
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Bismuth telluride nanoprism-assembled films;Lattice thermal conductivity;Monte-Carlo simulation;Effective medium approximation
公開日期: 1-八月-2015
摘要: This research aims at understanding the heat transfer phenomenon in the Bi2Te3 nanoprism-assembled films. For obtaining the associated effective thermal conductivity, the effective-medium-approximation (EMA) models existing in literature were examined and properly modified for prediction and Monte-Carlo numerical experiments based on unstructured grids were performed for confirmation. Cross-plane and in-plane thermal conductivities were both explored. For model predictions, the characteristic grain size of the nanoprisms is defined as either the phonon mean free path purely due to the grain boundary scattering (i.e. excluding the intrinsic scattering) or the averaged hydraulic diameter. A combination of a non-dilute 2D EMA model with the triple bond percolation theory turns out to be the best model for predicting the in-plane thermal conductivity. On the other hand, the evaluation of the cross-plane thermal conductivity by treating the nanoprisms as thermal conductors connected in parallel is satisfactory. The investigation shows that in addition to porosity, the scattering at the grain boundaries plays a dominant role in reducing the heat transfer in the direction perpendicular to the boundaries: the in-plane thermal conductivity is therefore much smaller than the cross-plane one. (C) 2015 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2015.04.040
http://hdl.handle.net/11536/127843
ISSN: 0017-9310
DOI: 10.1016/j.ijheatmasstransfer.2015.04.040
期刊: INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume: 87
起始頁: 536
結束頁: 543
顯示於類別:期刊論文