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dc.contributor.authorHsu, Tzu-Hsiangen_US
dc.contributor.authorYou, Hsin-Chiangen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:17:43Z-
dc.date.available2014-12-08T15:17:43Z-
dc.date.issued2006en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/12865-
dc.identifier.urihttp://dx.doi.org/10.1149/1.2337846en_US
dc.description.abstractIn this paper, we propose a method for depositing the charge trapping layer of a high-k polySi-SiO2-ZrO2-SiO2-Si (SOZOS) memory device. In this approach, the trapping layer was formed through simple two steps: (i) spin-coating of the ZrCl4 precursor and (ii) rapid thermal annealing for 1 min at 900 C under an oxygen atmosphere. The morphology of the ZrO2 charge trapping layer was confirmed through X-ray photoemission spectroscopy analysis. The sol-gel-derived layer exhibited improved charge trapping in the SOZOS memory device, resulting in a threshold voltage shift of 2.7 V in the I-d-V-g curve, P/E (program/erase) speeds as fast as 0.1 ms, good data retention up to 10(4) s (only a 5% charge loss due to deep trapping in the ZrO2 layer), and good endurance (no memory window narrowing after 10(5) P/E cycles). (c) 2006 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titlePolySi-SiO2-ZrO2-SiO2-Si flash memory incorporating a sol-gel-derived ZrO2 charge trapping layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.2337846en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume153en_US
dc.citation.issue11en_US
dc.citation.spageG934en_US
dc.citation.epageG937en_US
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000241057000049-
dc.citation.woscount42-
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