1. You are Here：

Full metadata record
DC FieldValueLanguage
dc.contributor.authorLIN Chien-Chungen_US
dc.contributor.authorKUO Hao-Chungen_US
dc.contributor.authorCHEN Kuo-Juen_US
dc.contributor.authorHAN Hau-Veien_US
dc.contributor.authorCHEN Hsin-Chuen_US
dc.date.accessioned2015-12-04T07:03:11Z-
dc.date.available2015-12-04T07:03:11Z-
dc.date.issued2015-07-02en_US
dc.identifier.govdocH01L033/48zh_TW
dc.identifier.govdocH01L033/56zh_TW
dc.identifier.govdocH01L033/58zh_TW
dc.identifier.govdocH01L033/50zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/128674-
dc.description.abstractA package structure applied for method for a solid-state lighting apparatus is disclosed in the present invention and at least comprises a frame, a light emitting member, an encapsulant and a plurality of fluorescent powders. The light emitting member is disposed in the frame. The encapsulant is provided to fill the frame for packing the light emitting member therein, and the fluorescent powders are dispersed in the encapsulant. Furthermore, there is a plurality of scattering particles doped into the encapsulant.zh_TW
dc.language.isozh_TWen_US
dc.titlePACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20150187998zh_TW
Appears in Collections:Patents


Files in This Item:

  1. 20150187998.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.

Related Contents
Loading...