标题: PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
作者: LIN Chien-Chung
KUO Hao-Chung
CHEN Kuo-Ju
HAN Hau-Vei
CHEN Hsin-Chu
公开日期: 2-七月-2015
摘要: A package structure applied for method for a solid-state lighting apparatus is disclosed in the present invention and at least comprises a frame, a light emitting member, an encapsulant and a plurality of fluorescent powders. The light emitting member is disposed in the frame. The encapsulant is provided to fill the frame for packing the light emitting member therein, and the fluorescent powders are dispersed in the encapsulant. Furthermore, there is a plurality of scattering particles doped into the encapsulant.
官方说明文件#: H01L033/48
H01L033/56
H01L033/58
H01L033/50
URI: http://hdl.handle.net/11536/128674
专利国: USA
专利号码: 20150187998
显示于类别:Patents


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  1. 20150187998.pdf

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