PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	LIN Chien-Chung	en_US
dc.contributor.author	KUO Hao-Chung	en_US
dc.contributor.author	CHEN Kuo-Ju	en_US
dc.contributor.author	HAN Hau-Vei	en_US
dc.contributor.author	CHEN Hsin-Chu	en_US
dc.date.accessioned	2015-12-04T07:03:11Z	-
dc.date.available	2015-12-04T07:03:11Z	-
dc.date.issued	2015-07-02	en_US
dc.identifier.govdoc	H01L033/48	zh_TW
dc.identifier.govdoc	H01L033/56	zh_TW
dc.identifier.govdoc	H01L033/58	zh_TW
dc.identifier.govdoc	H01L033/50	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/128674	-
dc.description.abstract	A package structure applied for method for a solid-state lighting apparatus is disclosed in the present invention and at least comprises a frame, a light emitting member, an encapsulant and a plurality of fluorescent powders. The light emitting member is disposed in the frame. The encapsulant is provided to fill the frame for packing the light emitting member therein, and the fluorescent powders are dispersed in the encapsulant. Furthermore, there is a plurality of scattering particles doped into the encapsulant.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20150187998	zh_TW
顯示於類別：	專利資料

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