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dc.contributor.authorChen, C. C.en_US
dc.contributor.authorKao, H. L.en_US
dc.contributor.authorChiang, K. C.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:17:50Z-
dc.date.available2014-12-08T15:17:50Z-
dc.date.issued2006-01-01en_US
dc.identifier.issn0195-9271en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s10762-006-9051-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/12928-
dc.description.abstractThis paper reports our progress in developing parallel coupled-line filters based on Si-based VLSI backend interconnects for millimeter-wave applications. The resonant frequency of this coupled-line filter increases with increasing spacing-gap and with increasing IDM thickness. By using high resistivity substrate, the parallel coupled-line band-pass filter is extremely effective in reducing substrate loss, and also provides very low insertion loss, even at the millimeter-wave regime. In addition, the parallel coupled-line filter suitable for advanced system-on-a-chips at the millimeter wave application achieves high performance characteristics, which show low insertion loss, wide band, and compatibility with standard VLSI process.en_US
dc.language.isoen_USen_US
dc.subjectparallel coupled-line filteren_US
dc.subjectVLSIen_US
dc.subjecthigh resistivity substrateen_US
dc.subjectmillimeter-waveen_US
dc.titleA parallel coupled-line filter using VLSI backend interconnect with high resistivity substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s10762-006-9051-5en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF INFRARED AND MILLIMETER WAVESen_US
dc.citation.volume27en_US
dc.citation.issue1en_US
dc.citation.spage93en_US
dc.citation.epage105en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000239628600008-
dc.citation.woscount0-
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