完整後設資料紀錄
DC 欄位語言
dc.contributor.author陳智 zh_TW
dc.date.accessioned2016-12-20T03:56:53Z-
dc.date.available2016-12-20T03:56:53Z-
dc.date.issued2016en_US
dc.identifier.govdocMOST105-2221-E009-008-MY3 zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=11900860&docId=491464en_US
dc.identifier.urihttp://hdl.handle.net/11536/131954-
dc.description.abstract zh_TW
dc.description.abstract en_US
dc.description.sponsorship科技部 zh_TW
dc.language.isozh_TWen_US
dc.subject zh_TW
dc.subject en_US
dc.title電鍍奈米雙晶銅-銅接合?究zh_TW
dc.titleCu-To-Cu Direct Bonding Using Electroplated Nanotwinned Cuen_US
dc.typePlanen_US
dc.contributor.department國立交通大學材料科學與工程學系(所) zh_TW
顯示於類別:研究計畫