| 標題: | 翻轉式晶片C4接合法冶金條件之研究 Under-Bump Metallurgy for Flip-Chip C4 Connection |
| 作者: | 邱碧秀 楊聰仁 交通大學電子研究所 |
| 關鍵字: | ; |
| 公開日期: | 1993 |
| 摘要: | |
| 官方說明文件#: | NSC82-0404-E009-142 |
| URI: | https://www.grb.gov.tw/search/planDetail?id=45837&docId=6582 http://hdl.handle.net/11536/132153 |
| 顯示於類別： | 研究計畫 |
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