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dc.contributor.authorShieh, MSen_US
dc.contributor.authorChen, PSen_US
dc.contributor.authorTsai, MJen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:18:21Z-
dc.date.available2014-12-08T15:18:21Z-
dc.date.issued2005-10-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2005.856011en_US
dc.identifier.urihttp://hdl.handle.net/11536/13243-
dc.description.abstractWe have demonstrated the fabrication of dynamic threshold voltage MOSFET (DTMOS) using the Si1-yCy(y = 0.005) incorporation inerlayer channel. Compare to conventional Si-DTMOS, the introduction of the Si1-yCy interlayer for this device is realized by super-steep-retrograde (SSR) channel profiles due to the retardation of boron diffusion. A low surface channel impurity with heavily doped substrate can be achieved simultaneously. This novel Si1-yCy channel heterostructure MOSFET exhibits higher transconductance and turn on current.en_US
dc.language.isoen_USen_US
dc.subjectDTMOSen_US
dc.subjectsuper-steep-retrograde (SSR) channelen_US
dc.subjectSi1-yCyen_US
dc.titleA novel dynamic threshold voltage MOSFET (DTMOS) using heterostructure channel of Si1-yCy interlayeren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2005.856011en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume26en_US
dc.citation.issue10en_US
dc.citation.spage740en_US
dc.citation.epage742en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000232208700014-
dc.citation.woscount1-
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